Parallel Microassembly with Electrostatic Force Fields

Microscopic (submillimeter) parts are often fabricated in parallel at high density but must then be assembled into patterns with lower spatial density. We propose a new approach to microassembly using: 1) ultrasonic vibration to eliminate friction and adhesion; and 2) electrostatic forces to position and align parts in parallel. We describe experiments on the dynamic and frictional properties of collections of microscopic parts under these conditions. We first demonstrate that ultrasonic vibration can be used to overcome adhesive forces; we also compare part behavior in air and vacuum. Next, we demonstrate that parts can be positioned and aligned using a combination of vibration and electrostatic forces. Finally, we demonstrate part sorting by size. Our goal is a systematic method for designing implementable planar force fields for microassembly based on part geometry.

Authors

• Karl-Friedrich Böhringer
• Ken Goldberg
• Michael Cohn
• Roger Howe
• Albert P. Pisano

Keywords

• Microassembly
• Electrostatics
• Micromechanical devices
• Microscopy
• Etching
• Electrodes
• Fabrication
• Robotic assembly
• Friction
• Adhesives
• Force Field
• Electrostatic Forces
• Electrostatic Field
• Ultrasonic Vibration
• Part Geometry
• Planar Field
• Artificial Potential Field
• Electrode
• Self-assembly
• Van Der Waals Interactions
• Flat Surface
• Regular Grid
• Flat Panel
• Piezoelectric Actuator
• Surface-mounted
• Electromechanical System
• Ultrasonic Frequency
• Parallel Plate Capacitor