Intelligent OPC Engineer Assistant for Semiconductor Manufacturing

Advancements in chip design and manufacturing have enabled the processing of complex tasks such as deep learning and natural language processing, paving the way for the development of artificial general intelligence (AGI). AI, on the other hand, can be leveraged to innovate and streamline semiconductor technology from planning and implementation to manufacturing. In this paper, we present Intelligent OPC Engineer Assistant, an AI/LLM-powered methodology designed to solve the core manufacturing-aware optimization problem known as Optical Proximity Correction (OPC). The methodology involves a reinforcement learning-based OPC recipe search and a customized multi-modal agent system for recipe summarization. Experiments demonstrate that our methodology can efficiently build OPC recipes on various chip designs with specially handled design topologies, a task that typically requires the full-time effort of OPC engineers with years of experience.

Authors

• Guojin Chen The Chinese University of Hong Kong
• Haoyu Yang NVIDIA
• Bei Yu The Chinese University of Hong Kong
• Haoxing Ren NVIDIA

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